Shares of Disco Corp (OTCMKTS:DSCSY – Get Free Report) hit a new 52-week low during trading on Thursday. The stock traded as low as $25.40 and last traded at $25.40, with a volume of 8,601 shares traded. The stock had previously closed at $31.21.
Analyst Ratings Changes
A number of research analysts recently issued reports on the stock. Zacks Research upgraded shares of Disco from a “hold” rating to a “strong-buy” rating in a research report on Monday, October 5th. Jefferies Financial Group upgraded shares of Disco from a “hold” rating to a “buy” rating in a report on Monday, July 27th. One investment analyst has rated the stock with a Strong Buy rating and one has assigned a Buy rating to the company’s stock. According to MarketBeat, the company has an average rating of “Strong Buy”.
View Our Latest Stock Analysis on Disco
Disco Stock Down 17.1%
Disco (OTCMKTS:DSCSY – Get Free Report) last issued its earnings results on Thursday, October 22nd. The company reported $0.27 earnings per share (EPS) for the quarter. The company had revenue of $897.04 million for the quarter. Disco had a return on equity of 27.68% and a net margin of 32.04%. Equities analysts expect that Disco Corp will post 1.11 earnings per share for the current year.
Institutional Investors Weigh In On Disco
A hedge fund recently bought a new position in Disco stock. Azimuth Capital Investment Management LLC bought a new position in Disco Corp (OTCMKTS:DSCSY – Free Report) during the second quarter, according to the company in its most recent 13F filing with the SEC. The institutional investor bought 237,250 shares of the company’s stock, valued at approximately $11,862,000. Hedge funds and other institutional investors own 0.03% of the company’s stock.
About Disco
DISCO Corporation is a Japan-based manufacturer of precision equipment and tools used in the semiconductor and electronics industries. The company develops and produces systems for wafer dicing, grinding and polishing, as well as related consumables such as diamond wheels and other cutting tools.
Its products are used to separate semiconductor wafers into individual chips and to shape, thin and finish semiconductor materials with high precision. DISCO also provides equipment, tools and technical support for applications involving silicon, compound semiconductors and other electronic materials.
Founded in 1937 and headquartered in Tokyo, DISCO serves customers internationally through a global network of sales, service and production operations.
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