Tokyo Electron (OTCMKTS:TOELY) Issues FY 2026 Earnings Guidance

Tokyo Electron (OTCMKTS:TOELY) issued an update on its FY 2026 earnings guidance on Friday morning. The company provided EPS guidance of 3.611-3.611 for the period. The company issued revenue guidance of $16.1 billion-$16.1 billion, compared to the consensus revenue estimate of $15.8 billion.

Tokyo Electron Stock Up 0.6%

Tokyo Electron stock traded up $0.61 during trading on Friday, reaching $107.00. The stock had a trading volume of 111,126 shares, compared to its average volume of 154,625. Tokyo Electron has a 52-week low of $58.17 and a 52-week high of $114.53. The stock has a market cap of $98.59 billion, a PE ratio of 27.16 and a beta of 1.93. The business has a 50 day moving average price of $90.86 and a 200 day moving average price of $84.72.

Tokyo Electron (OTCMKTS:TOELY) last announced its quarterly earnings results on Friday, October 31st. The company reported $0.90 earnings per share (EPS) for the quarter, topping analysts’ consensus estimates of $0.87 by $0.03. Tokyo Electron had a return on equity of 29.10% and a net margin of 21.74%.The company had revenue of $4.27 billion during the quarter, compared to the consensus estimate of $4.06 billion. On average, equities analysts predict that Tokyo Electron will post 3.23 EPS for the current fiscal year.

Analyst Ratings Changes

Separately, Zacks Research downgraded shares of Tokyo Electron from a “hold” rating to a “strong sell” rating in a research report on Monday, September 22nd. One equities research analyst has rated the stock with a Sell rating, According to MarketBeat, the stock currently has an average rating of “Sell”.

About Tokyo Electron

Tokyo Electron Limited, together with its subsidiaries, develops, manufactures, and sells semiconductor and flat panel display (FPD) production equipment in Japan, Europe, North America, Taiwan, China, South Korea, Southeast Asia, and internationally. The company offers coaters/developers, etch systems, surface preparation systems, deposition systems, test systems, wafer bonders/debonders, wafer edge trimming, SiC epitaxial CVD systems, gas cluster ion beam system, and cleaning systems.