Disco Corp (OTCMKTS:DSCSY) Sees Significant Increase in Short Interest

Disco Corp (OTCMKTS:DSCSY) saw a large increase in short interest during the month of July. As of July 31st, there was short interest totaling 22,522 shares, an increase of 112.5% from the July 15th total of 10,600 shares. Approximately 0.0% of the company’s stock are short sold. Based on an average daily trading volume, of 886,482 shares, the days-to-cover ratio is currently 0.0 days.

Disco Stock Performance

Shares of OTCMKTS DSCSY traded down $1.11 during trading on Friday, hitting $40.71. The company had a trading volume of 135,287 shares, compared to its average volume of 395,278. Disco has a 52 week low of $24.94 and a 52 week high of $58.00. The company has a market cap of $44.16 billion, a P/E ratio of 46.79 and a beta of 1.55. The business’s 50-day moving average is $43.91 and its 200 day moving average is $44.29.

Disco (OTCMKTS:DSCSY) last announced its earnings results on Thursday, July 23rd. The company reported $0.20 earnings per share (EPS) for the quarter. The company had revenue of $717.28 million for the quarter. Disco had a net margin of 31.65% and a return on equity of 26.03%. On average, research analysts expect that Disco will post 1.05 EPS for the current year.

Wall Street Analysts Forecast Growth

A number of equities research analysts have recently weighed in on DSCSY shares. Jefferies Financial Group upgraded Disco from a “hold” rating to a “buy” rating in a report on Monday, July 27th. Zacks Research cut Disco from a “strong-buy” rating to a “hold” rating in a research note on Tuesday, May 19th. One investment analyst has rated the stock with a Buy rating and one has assigned a Hold rating to the company’s stock. According to MarketBeat, the company currently has a consensus rating of “Moderate Buy”.

About Disco

Disco (OTCMKTS: DSCSY) is a manufacturer of precision processing equipment and consumables for the semiconductor and electronics industries. The company’s product portfolio includes wafer dicing saws, wafer thinning and grinding systems, laser dicing equipment, polishing systems, and diamond blades and wheels, along with associated tooling and process consumables designed for high-precision cutting and surface finishing.

Disco’s products are used in critical back-end semiconductor manufacturing steps such as dicing, singulation, thinning, surface preparation and polishing across applications including IC packaging, power devices, LEDs, MEMS and sensors.