United Microelectronics Corporation (NYSE:UMC – Get Free Report) declared an annual dividend on Tuesday, June 23rd. Stockholders of record on Wednesday, July 8th will be given a dividend of 0.4122 per share by the semiconductor company on Thursday, August 6th. This represents a dividend yield of 144.0%. The ex-dividend date is Wednesday, July 8th. This is a 12.6% increase from United Microelectronics’s previous annual dividend of $0.37.
United Microelectronics has increased its dividend payment by an average of 0.3%annually over the last three years. United Microelectronics has a dividend payout ratio of 60.7% meaning its dividend is sufficiently covered by earnings. Equities research analysts expect United Microelectronics to earn $0.84 per share next year, which means the company should continue to be able to cover its $0.37 annual dividend with an expected future payout ratio of 44.0%.
United Microelectronics Stock Performance
Shares of United Microelectronics stock traded up $2.44 during trading on Wednesday, hitting $28.64. 13,285,669 shares of the company’s stock traded hands, compared to its average volume of 13,198,856. United Microelectronics has a 1 year low of $6.56 and a 1 year high of $28.58. The business has a 50-day simple moving average of $17.52 and a 200-day simple moving average of $12.19. The stock has a market capitalization of $72.11 billion, a P/E ratio of 44.06, a PEG ratio of 3.24 and a beta of 1.61. The company has a debt-to-equity ratio of 0.12, a current ratio of 2.72 and a quick ratio of 2.23.
United Microelectronics Company Profile
United Microelectronics Corporation (UMC) is a Taiwan-based semiconductor foundry that provides wafer fabrication and related manufacturing services to a global customer base. Founded in 1980, the company operates as a pure-play foundry, producing integrated circuits for a range of customers including fabless semiconductor companies and integrated device manufacturers. UMC is publicly listed (NYSE: UMC) and focuses on high-reliability manufacturing rather than branding consumer products.
UMC’s core services encompass wafer fabrication using a portfolio of process technologies, with particular emphasis on mature and specialty nodes that support analog, power-management, radio-frequency (RF), and mixed-signal applications.
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