Disco Corp (OTCMKTS:DSCSY) Short Interest Down 90.9% in May

Disco Corp (OTCMKTS:DSCSY) saw a large decrease in short interest in May. As of May 29th, there was short interest totaling 15,431 shares, a decrease of 90.9% from the May 14th total of 168,911 shares. Approximately 0.0% of the shares of the stock are sold short. Based on an average daily volume of 522,973 shares, the days-to-cover ratio is currently 0.0 days.

Disco Stock Up 7.2%

Shares of OTCMKTS DSCSY traded up $3.11 during midday trading on Thursday, reaching $46.02. 96,944 shares of the company were exchanged, compared to its average volume of 279,720. The stock’s 50-day moving average price is $43.88 and its 200-day moving average price is $40.51. The stock has a market cap of $49.92 billion, a P/E ratio of 56.12 and a beta of 1.54. Disco has a one year low of $22.92 and a one year high of $52.99.

Disco (OTCMKTS:DSCSY) last issued its quarterly earnings data on Wednesday, April 22nd. The company reported $0.25 earnings per share for the quarter. The business had revenue of $848.13 million for the quarter, compared to analyst estimates of $771.53 million. Disco had a return on equity of 25.27% and a net margin of 30.95%. On average, equities research analysts anticipate that Disco will post 1.07 EPS for the current year.

Analyst Upgrades and Downgrades

Separately, Zacks Research lowered Disco from a “strong-buy” rating to a “hold” rating in a research note on Tuesday, May 19th. One research analyst has rated the stock with a Strong Buy rating and one has issued a Hold rating to the company’s stock. According to MarketBeat, the company has an average rating of “Buy”.

About Disco

Disco (OTCMKTS: DSCSY) is a manufacturer of precision processing equipment and consumables for the semiconductor and electronics industries. The company’s product portfolio includes wafer dicing saws, wafer thinning and grinding systems, laser dicing equipment, polishing systems, and diamond blades and wheels, along with associated tooling and process consumables designed for high-precision cutting and surface finishing.

Disco’s products are used in critical back-end semiconductor manufacturing steps such as dicing, singulation, thinning, surface preparation and polishing across applications including IC packaging, power devices, LEDs, MEMS and sensors.