Disco Corp (OTCMKTS:DSCSY) Sees Large Increase in Short Interest

Disco Corp (OTCMKTS:DSCSY) was the recipient of a large growth in short interest in the month of May. As of May 15th, there was short interest totaling 168,911 shares, a growth of 747.0% from the April 30th total of 19,942 shares. Approximately 0.0% of the company’s shares are sold short. Based on an average daily trading volume, of 220,200 shares, the days-to-cover ratio is presently 0.8 days.

Disco Price Performance

Shares of DSCSY stock traded down $1.48 on Friday, hitting $41.14. The stock had a trading volume of 68,817 shares, compared to its average volume of 290,740. The company’s 50 day moving average price is $43.68 and its 200-day moving average price is $39.72. Disco has a 1 year low of $22.08 and a 1 year high of $52.99. The firm has a market capitalization of $44.63 billion, a P/E ratio of 50.17 and a beta of 1.63.

Disco (OTCMKTS:DSCSY) last posted its quarterly earnings results on Wednesday, April 22nd. The company reported $0.25 earnings per share (EPS) for the quarter. The company had revenue of $848.13 million for the quarter, compared to analyst estimates of $771.53 million. Disco had a return on equity of 25.27% and a net margin of 30.95%. On average, equities analysts forecast that Disco will post 1.07 EPS for the current year.

Analysts Set New Price Targets

Separately, Zacks Research downgraded Disco from a “strong-buy” rating to a “hold” rating in a report on Tuesday, May 19th. One investment analyst has rated the stock with a Strong Buy rating and one has given a Hold rating to the stock. Based on data from MarketBeat, the company has an average rating of “Buy”.

Disco Company Profile

Disco (OTCMKTS: DSCSY) is a manufacturer of precision processing equipment and consumables for the semiconductor and electronics industries. The company’s product portfolio includes wafer dicing saws, wafer thinning and grinding systems, laser dicing equipment, polishing systems, and diamond blades and wheels, along with associated tooling and process consumables designed for high-precision cutting and surface finishing.

Disco’s products are used in critical back-end semiconductor manufacturing steps such as dicing, singulation, thinning, surface preparation and polishing across applications including IC packaging, power devices, LEDs, MEMS and sensors.