BE Semiconductor Industries (OTCMKTS:BESIY) Shares Gap Down – Should You Sell?

Posted by Andrew Walz on Mar 20th, 2026

BE Semiconductor Industries NV (OTCMKTS:BESIY – Get Free Report) gapped down before the market opened on Friday . The stock had previously closed at $220.00, but opened at $210.92. BE Semiconductor Industries shares last traded at $209.3950, with a volume of 1,427 shares traded.

Analyst Upgrades and Downgrades

Several equities research analysts have weighed in on the stock. Kepler Capital Markets downgraded shares of BE Semiconductor Industries from a “strong-buy” rating to a “hold” rating in a research note on Friday, January 9th. Citigroup reissued a “neutral” rating on shares of BE Semiconductor Industries in a research note on Tuesday, January 20th. Morgan Stanley restated an “overweight” rating on shares of BE Semiconductor Industries in a research report on Tuesday, January 13th. Berenberg Bank raised BE Semiconductor Industries to a “hold” rating in a research note on Monday, February 23rd. Finally, Needham & Company LLC raised BE Semiconductor Industries to a “buy” rating in a research note on Tuesday, January 6th. Five equities research analysts have rated the stock with a Buy rating and six have given a Hold rating to the stock. According to data from MarketBeat.com, BE Semiconductor Industries has an average rating of “Hold”.

Read Our Latest Report on BESIY

BE Semiconductor Industries Stock Down 2.2%

The firm’s 50-day simple moving average is $206.45 and its 200 day simple moving average is $173.09. The company has a debt-to-equity ratio of 1.22, a quick ratio of 5.02 and a current ratio of 5.55. The company has a market cap of $15.15 billion, a P/E ratio of 111.71 and a beta of 1.81.

About BE Semiconductor Industries

(Get Free Report)

BE Semiconductor Industries NV (OTCMKTS:BESIY), commonly known as BESI, is a global supplier of assembly equipment for the semiconductor industry. The company designs, develops and manufactures capital equipment used in the back-end production of semiconductor devices, including die attach, wire bonding and flip chip packaging systems. BESI’s platforms support a wide range of applications from memory and logic chips to advanced power devices and radio-frequency modules, enabling high precision, throughput and yield in device assembly and test processes.

Founded in 1995 and headquartered in Duiven, the Netherlands, BESI went public on Euronext Amsterdam in 1999.