Short Interest in BE Semiconductor Industries NV (OTCMKTS:BESIY) Grows By 2,256.4%

BE Semiconductor Industries NV (OTCMKTS:BESIY) was the recipient of a significant increase in short interest in the month of February. As of February 13th, there was short interest totaling 24,601 shares, an increase of 2,256.4% from the January 29th total of 1,044 shares. Based on an average daily volume of 12,487 shares, the days-to-cover ratio is currently 2.0 days. Based on an average daily volume of 12,487 shares, the days-to-cover ratio is currently 2.0 days.

Analyst Upgrades and Downgrades

BESIY has been the topic of several recent research reports. Citigroup reaffirmed a “neutral” rating on shares of BE Semiconductor Industries in a research note on Tuesday, January 20th. Berenberg Bank upgraded shares of BE Semiconductor Industries to a “hold” rating in a report on Monday. Needham & Company LLC raised shares of BE Semiconductor Industries to a “buy” rating in a report on Tuesday, January 6th. Morgan Stanley reissued an “overweight” rating on shares of BE Semiconductor Industries in a research note on Tuesday, January 13th. Finally, Kepler Capital Markets lowered BE Semiconductor Industries from a “strong-buy” rating to a “hold” rating in a research report on Friday, January 9th. Five research analysts have rated the stock with a Buy rating and six have issued a Hold rating to the company’s stock. According to MarketBeat, the company presently has a consensus rating of “Hold”.

BE Semiconductor Industries Trading Down 4.9%

BESIY opened at $223.42 on Friday. The firm’s fifty day moving average is $192.20 and its two-hundred day moving average is $165.67. The firm has a market cap of $16.20 billion, a PE ratio of 119.48 and a beta of 1.85. BE Semiconductor Industries has a twelve month low of $88.02 and a twelve month high of $235.17. The company has a debt-to-equity ratio of 1.46, a quick ratio of 5.02 and a current ratio of 5.75.

About BE Semiconductor Industries

BE Semiconductor Industries NV (OTCMKTS:BESIY), commonly known as BESI, is a global supplier of assembly equipment for the semiconductor industry. The company designs, develops and manufactures capital equipment used in the back-end production of semiconductor devices, including die attach, wire bonding and flip chip packaging systems. BESI’s platforms support a wide range of applications from memory and logic chips to advanced power devices and radio-frequency modules, enabling high precision, throughput and yield in device assembly and test processes.

Founded in 1995 and headquartered in Duiven, the Netherlands, BESI went public on Euronext Amsterdam in 1999.