BE Semiconductor Industries NV (OTCMKTS:BESIY – Get Free Report) saw a large decline in short interest in January. As of January 30th, there was short interest totaling 1,044 shares, a decline of 77.1% from the January 15th total of 4,556 shares. Based on an average daily trading volume, of 6,665 shares, the short-interest ratio is presently 0.2 days. Based on an average daily trading volume, of 6,665 shares, the short-interest ratio is presently 0.2 days.
BE Semiconductor Industries Stock Up 1.8%
BE Semiconductor Industries stock opened at $205.56 on Thursday. BE Semiconductor Industries has a fifty-two week low of $88.02 and a fifty-two week high of $210.76. The firm’s 50 day simple moving average is $179.29 and its 200-day simple moving average is $159.59. The company has a debt-to-equity ratio of 1.46, a current ratio of 5.75 and a quick ratio of 5.02.
Wall Street Analyst Weigh In
Several brokerages have commented on BESIY. UBS Group reiterated a “buy” rating on shares of BE Semiconductor Industries in a research report on Friday, October 24th. Deutsche Bank Aktiengesellschaft reiterated a “buy” rating on shares of BE Semiconductor Industries in a report on Wednesday, October 15th. Needham & Company LLC upgraded shares of BE Semiconductor Industries to a “buy” rating in a report on Tuesday, January 6th. Morgan Stanley reaffirmed an “overweight” rating on shares of BE Semiconductor Industries in a report on Tuesday, January 13th. Finally, Citigroup reiterated a “neutral” rating on shares of BE Semiconductor Industries in a research report on Tuesday, January 20th. Five analysts have rated the stock with a Buy rating and five have given a Hold rating to the company. According to data from MarketBeat, the company presently has an average rating of “Moderate Buy”.
BE Semiconductor Industries Company Profile
BE Semiconductor Industries NV (OTCMKTS:BESIY), commonly known as BESI, is a global supplier of assembly equipment for the semiconductor industry. The company designs, develops and manufactures capital equipment used in the back-end production of semiconductor devices, including die attach, wire bonding and flip chip packaging systems. BESI’s platforms support a wide range of applications from memory and logic chips to advanced power devices and radio-frequency modules, enabling high precision, throughput and yield in device assembly and test processes.
Founded in 1995 and headquartered in Duiven, the Netherlands, BESI went public on Euronext Amsterdam in 1999.
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