Amkor Technology, Inc. (AMKR) To Go Ex-Dividend on March 13th

Amkor Technology, Inc. (NASDAQ:AMKR) declared a quarterly dividend on Thursday, February 20th, Wall Street Journal reports. Stockholders of record on Thursday, March 13th will be given a dividend of 0.0827 per share by the semiconductor company on Wednesday, April 2nd. This represents a $0.33 annualized dividend and a dividend yield of 1.67%. The ex-dividend date is Thursday, March 13th.

Amkor Technology has raised its dividend payment by an average of 23.3% annually over the last three years. Amkor Technology has a dividend payout ratio of 16.4% meaning its dividend is sufficiently covered by earnings. Research analysts expect Amkor Technology to earn $1.98 per share next year, which means the company should continue to be able to cover its $0.33 annual dividend with an expected future payout ratio of 16.7%.

Amkor Technology Price Performance

Shares of NASDAQ:AMKR opened at $19.82 on Tuesday. Amkor Technology has a fifty-two week low of $19.65 and a fifty-two week high of $44.86. The business has a 50-day simple moving average of $23.85 and a two-hundred day simple moving average of $26.87. The company has a debt-to-equity ratio of 0.22, a quick ratio of 1.90 and a current ratio of 2.11. The firm has a market cap of $4.89 billion, a price-to-earnings ratio of 13.86 and a beta of 1.88.

Amkor Technology (NASDAQ:AMKR) last released its quarterly earnings results on Monday, February 10th. The semiconductor company reported $0.43 earnings per share (EPS) for the quarter, beating analysts’ consensus estimates of $0.37 by $0.06. Amkor Technology had a return on equity of 8.59% and a net margin of 5.60%. On average, analysts expect that Amkor Technology will post 1.47 earnings per share for the current year.

Analyst Ratings Changes

Several research firms recently issued reports on AMKR. B. Riley reduced their target price on shares of Amkor Technology from $38.00 to $32.00 and set a “buy” rating for the company in a report on Tuesday, February 11th. Melius lowered shares of Amkor Technology from a “buy” rating to a “hold” rating and cut their price objective for the company from $34.00 to $30.00 in a report on Monday, January 6th. Morgan Stanley lowered their target price on Amkor Technology from $26.00 to $24.00 and set an “equal weight” rating for the company in a research report on Tuesday, February 11th. Needham & Company LLC reiterated a “buy” rating and set a $34.00 target price on shares of Amkor Technology in a research report on Tuesday, February 11th. Finally, Melius Research downgraded Amkor Technology from a “strong-buy” rating to a “hold” rating in a research report on Monday, January 6th. Six investment analysts have rated the stock with a hold rating and five have assigned a buy rating to the company. According to data from MarketBeat.com, the company has a consensus rating of “Hold” and a consensus price target of $31.50.

Insider Transactions at Amkor Technology

In other Amkor Technology news, EVP Kevin Engel sold 5,489 shares of Amkor Technology stock in a transaction dated Tuesday, February 25th. The stock was sold at an average price of $21.69, for a total value of $119,056.41. Following the transaction, the executive vice president now owns 1,388 shares in the company, valued at $30,105.72. The trade was a 79.82 % decrease in their ownership of the stock. The transaction was disclosed in a document filed with the Securities & Exchange Commission, which is available at the SEC website. Also, major shareholder Agnes C. Kim sold 869,565 shares of Amkor Technology stock in a transaction dated Monday, February 24th. The shares were sold at an average price of $21.85, for a total value of $18,999,995.25. Following the completion of the transaction, the insider now owns 10,020,870 shares in the company, valued at $218,956,009.50. This trade represents a 7.98 % decrease in their position. The disclosure for this sale can be found here. Corporate insiders own 31.40% of the company’s stock.

About Amkor Technology

Amkor Technology, Inc provides outsourced semiconductor packaging and test services in the United States, Japan, Europe, the Middle East, Africa, and the Asia Pacific. It offers turnkey packaging and test services, including semiconductor wafer bump, wafer probe, wafer back-grind, package design, packaging, system-level and final test, and drop shipment services; flip chip scale package products for smartphones, tablets, and other mobile consumer electronic devices; flip chip stacked chip scale packages that are used to stack memory digital baseband, and as applications processors in mobile devices; flip-chip ball grid array packages for various networking, storage, computing, automotive, and consumer applications; and memory products for system memory or platform data storage.