BE Semiconductor Industries NV (OTCMKTS:BESIY) Sees Significant Growth in Short Interest

BE Semiconductor Industries NV (OTCMKTS:BESIY) was the target of a significant growth in short interest during the month of October. As of October 15th, there was short interest totaling 2,511 shares, a growth of 423.1% from the September 30th total of 480 shares. Currently, 0.0% of the shares of the stock are short sold. Based on an average daily trading volume, of 25,823 shares, the short-interest ratio is presently 0.1 days.

Analysts Set New Price Targets

BESIY has been the topic of several recent research reports. Berenberg Bank upgraded BE Semiconductor Industries from a “hold” rating to a “strong-buy” rating in a report on Tuesday, August 4th. Morgan Stanley reissued an “overweight” rating on shares of BE Semiconductor Industries in a research note on Tuesday, September 8th. UBS Group cut BE Semiconductor Industries from a “buy” rating to a “sell” rating in a research note on Wednesday, October 7th. Finally, Zacks Research lowered BE Semiconductor Industries from a “strong-buy” rating to a “hold” rating in a research note on Friday, September 25th. One investment analyst has rated the stock with a Strong Buy rating, four have assigned a Buy rating, three have given a Hold rating and one has assigned a Sell rating to the company. According to MarketBeat, the stock currently has a consensus rating of “Moderate Buy”.

BE Semiconductor Industries Trading Up 12.1%

OTCMKTS:BESIY opened at $183.08 on Wednesday. The stock has a fifty day moving average price of $211.13 and a 200 day moving average price of $246.23. BE Semiconductor Industries has a 12-month low of $140.07 and a 12-month high of $374.33.

About BE Semiconductor Industries

BE Semiconductor Industries N.V. (BESI) is a Netherlands-based manufacturer of semiconductor assembly equipment. The company develops and supplies systems used to package semiconductor devices after wafer fabrication, helping customers assemble, connect, protect and test chips for use in electronic products.

BESI’s product portfolio includes die-attach equipment, packaging systems, molding equipment and singulation systems. Its technologies support applications such as advanced semiconductor packaging, flip-chip assembly, thermo-compression bonding and hybrid bonding, which are used in products requiring higher performance, smaller dimensions and improved power efficiency.

Founded in 1995 and headquartered in Duiven, the Netherlands, BESI serves semiconductor manufacturers and assembly and test providers worldwide.