BE Semiconductor Industries (OTCMKTS:BESIY) Shares Gap Up – Time to Buy?

BE Semiconductor Industries NV (OTCMKTS:BESIY)’s share price gapped up prior to trading on Tuesday. The stock had previously closed at $163.30, but opened at $178.87. BE Semiconductor Industries shares last traded at $179.33, with a volume of 1,535 shares changing hands.

Analyst Upgrades and Downgrades

Several research firms recently commented on BESIY. Berenberg Bank raised shares of BE Semiconductor Industries from a “hold” rating to a “strong-buy” rating in a report on Tuesday, August 4th. Morgan Stanley reissued an “overweight” rating on shares of BE Semiconductor Industries in a research note on Tuesday, September 8th. Zacks Research downgraded shares of BE Semiconductor Industries from a “strong-buy” rating to a “hold” rating in a research note on Friday, September 25th. Finally, UBS Group lowered shares of BE Semiconductor Industries from a “buy” rating to a “sell” rating in a research report on Wednesday, October 7th. One research analyst has rated the stock with a Strong Buy rating, four have given a Buy rating, three have issued a Hold rating and one has given a Sell rating to the company. Based on data from MarketBeat.com, BE Semiconductor Industries presently has an average rating of “Moderate Buy”.

BE Semiconductor Industries Stock Up 10.3%

The company has a current ratio of 4.28, a quick ratio of 3.73 and a debt-to-equity ratio of 0.60. The stock has a 50 day simple moving average of $212.95 and a 200 day simple moving average of $246.25. The firm has a market capitalization of $13.07 billion, a PE ratio of 59.08 and a beta of 1.99.

BE Semiconductor Industries Company Profile

BE Semiconductor Industries N.V. (BESI) is a Netherlands-based manufacturer of semiconductor assembly equipment. The company develops and supplies systems used to package semiconductor devices after wafer fabrication, helping customers assemble, connect, protect and test chips for use in electronic products.

BESI’s product portfolio includes die-attach equipment, packaging systems, molding equipment and singulation systems. Its technologies support applications such as advanced semiconductor packaging, flip-chip assembly, thermo-compression bonding and hybrid bonding, which are used in products requiring higher performance, smaller dimensions and improved power efficiency.

Founded in 1995 and headquartered in Duiven, the Netherlands, BESI serves semiconductor manufacturers and assembly and test providers worldwide.