BE Semiconductor Industries NV (OTCMKTS:BESIY – Get Free Report) has been assigned an average rating of “Moderate Buy” from the nine analysts that are currently covering the firm, MarketBeat Ratings reports. One research analyst has rated the stock with a sell rating, three have assigned a hold rating, four have assigned a buy rating and one has issued a strong buy rating on the company.
Several analysts have commented on BESIY shares. UBS Group lowered BE Semiconductor Industries from a “buy” rating to a “sell” rating in a report on Wednesday. Morgan Stanley restated an “overweight” rating on shares of BE Semiconductor Industries in a research report on Tuesday, September 8th. Zacks Research downgraded BE Semiconductor Industries from a “strong-buy” rating to a “hold” rating in a research note on Friday, September 25th. Finally, Berenberg Bank raised BE Semiconductor Industries from a “hold” rating to a “strong-buy” rating in a research note on Tuesday, August 4th.
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BE Semiconductor Industries Price Performance
BE Semiconductor Industries (OTCMKTS:BESIY – Get Free Report) last announced its quarterly earnings results on Thursday, July 23rd. The technology company reported $1.29 earnings per share for the quarter, missing the consensus estimate of $1.30 by ($0.01). The business had revenue of $290.52 million during the quarter, compared to analysts’ expectations of $285.58 million. BE Semiconductor Industries had a net margin of 28.42% and a return on equity of 46.44%. As a group, equities analysts expect that BE Semiconductor Industries will post 4.83 EPS for the current fiscal year.
BE Semiconductor Industries Company Profile
BE Semiconductor Industries N.V. (Besi) is a Netherlands-based manufacturer of semiconductor assembly equipment. The company develops and supplies systems used to assemble, package, and finish semiconductor devices after wafer fabrication.
Besi’s product portfolio includes die-attach equipment, packaging systems, molding and singulation equipment, plating systems, and related solutions for advanced semiconductor packaging. Its technologies support applications such as flip-chip, wafer-level packaging, thermo-compression bonding, and hybrid bonding, which are used in electronics, communications, automotive, computing, and other semiconductor markets.
Founded in 1995 and headquartered in Duiven, the Netherlands, Besi serves semiconductor manufacturers and assembly and test providers worldwide.
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