Disco (OTCMKTS:DSCSY) Sees Large Volume Increase – Should You Buy?

Shares of Disco Corp (OTCMKTS:DSCSY) saw an uptick in trading volume on Friday . 363,268 shares traded hands during trading, an increase of 20% from the previous session’s volume of 302,239 shares.The stock last traded at $36.7412 and had previously closed at $30.97.

Wall Street Analyst Weigh In

Several equities analysts have weighed in on DSCSY shares. Zacks Research lowered Disco from a “strong-buy” rating to a “hold” rating in a report on Tuesday, May 19th. Jefferies Financial Group upgraded Disco from a “hold” rating to a “buy” rating in a research note on Monday. One research analyst has rated the stock with a Buy rating and one has issued a Hold rating to the company’s stock. Based on data from MarketBeat, the company currently has a consensus rating of “Moderate Buy”.

Disco Price Performance

The stock’s 50 day moving average price is $44.58 and its two-hundred day moving average price is $44.30. The firm has a market capitalization of $37.96 billion, a price-to-earnings ratio of 40.22 and a beta of 1.50.

Disco (OTCMKTS:DSCSY) last posted its quarterly earnings data on Thursday, July 23rd. The company reported $0.20 earnings per share (EPS) for the quarter. Disco had a net margin of 31.65% and a return on equity of 26.08%. The business had revenue of $717.28 million during the quarter. As a group, equities research analysts anticipate that Disco Corp will post 1.05 EPS for the current fiscal year.

About Disco

Disco (OTCMKTS: DSCSY) is a manufacturer of precision processing equipment and consumables for the semiconductor and electronics industries. The company’s product portfolio includes wafer dicing saws, wafer thinning and grinding systems, laser dicing equipment, polishing systems, and diamond blades and wheels, along with associated tooling and process consumables designed for high-precision cutting and surface finishing.

Disco’s products are used in critical back-end semiconductor manufacturing steps such as dicing, singulation, thinning, surface preparation and polishing across applications including IC packaging, power devices, LEDs, MEMS and sensors.