BE Semiconductor Industries (OTCMKTS:BESIY) Shares Gap Down – Should You Sell?

Posted by Don Miller on Mar 27th, 2026

BE Semiconductor Industries NV (OTCMKTS:BESIY – Get Free Report) gapped down before the market opened on Friday . The stock had previously closed at $213.00, but opened at $203.00. BE Semiconductor Industries shares last traded at $200.52, with a volume of 1,632 shares.

Wall Street Analyst Weigh In

A number of research analysts have weighed in on BESIY shares. Needham & Company LLC raised shares of BE Semiconductor Industries to a “buy” rating in a research note on Tuesday, January 6th. Berenberg Bank upgraded shares of BE Semiconductor Industries to a “hold” rating in a report on Monday, February 23rd. Citigroup reaffirmed a “neutral” rating on shares of BE Semiconductor Industries in a research report on Tuesday, January 20th. Kepler Capital Markets cut BE Semiconductor Industries from a “strong-buy” rating to a “hold” rating in a report on Friday, January 9th. Finally, Sanford C. Bernstein reissued an “outperform” rating on shares of BE Semiconductor Industries in a research note on Sunday, January 4th. Five equities research analysts have rated the stock with a Buy rating and six have issued a Hold rating to the company. Based on data from MarketBeat, the company presently has a consensus rating of “Hold”.

Read Our Latest Stock Report on BESIY

BE Semiconductor Industries Stock Performance

The stock’s 50-day moving average price is $208.86 and its 200 day moving average price is $176.11. The firm has a market cap of $14.43 billion, a P/E ratio of 106.42 and a beta of 1.81. The company has a debt-to-equity ratio of 1.22, a current ratio of 5.55 and a quick ratio of 4.88.

BE Semiconductor Industries Company Profile

(Get Free Report)

BE Semiconductor Industries NV (OTCMKTS:BESIY), commonly known as BESI, is a global supplier of assembly equipment for the semiconductor industry. The company designs, develops and manufactures capital equipment used in the back-end production of semiconductor devices, including die attach, wire bonding and flip chip packaging systems. BESI’s platforms support a wide range of applications from memory and logic chips to advanced power devices and radio-frequency modules, enabling high precision, throughput and yield in device assembly and test processes.

Founded in 1995 and headquartered in Duiven, the Netherlands, BESI went public on Euronext Amsterdam in 1999.