NXP Semiconductors N.V. (NASDAQ:NXPI – Get Free Report) declared a quarterly dividend on Thursday, March 12th. Investors of record on Wednesday, March 25th will be given a dividend of 1.014 per share by the semiconductor provider on Thursday, April 9th. This represents a c) annualized dividend and a yield of 2.1%. The ex-dividend date of this dividend is Wednesday, March 25th.
NXP Semiconductors has raised its dividend payment by an average of 0.2%annually over the last three years. NXP Semiconductors has a dividend payout ratio of 29.4% meaning its dividend is sufficiently covered by earnings. Analysts expect NXP Semiconductors to earn $12.53 per share next year, which means the company should continue to be able to cover its $4.05 annual dividend with an expected future payout ratio of 32.3%.
NXP Semiconductors Stock Performance
NASDAQ NXPI traded down $8.65 during trading hours on Thursday, reaching $191.22. 3,419,625 shares of the company were exchanged, compared to its average volume of 2,972,684. The stock has a market capitalization of $48.32 billion, a P/E ratio of 24.08, a P/E/G ratio of 0.91 and a beta of 1.45. The company has a quick ratio of 1.38, a current ratio of 2.05 and a debt-to-equity ratio of 1.09. NXP Semiconductors has a 1 year low of $148.09 and a 1 year high of $256.36. The business’s 50 day simple moving average is $230.13 and its 200-day simple moving average is $222.30.
About NXP Semiconductors
NXP Semiconductors N.V. is a global semiconductor company headquartered in Eindhoven, the Netherlands, that designs and supplies mixed-signal and standard product solutions for a broad range of end markets. The company focuses on enabling secure connections and infrastructure for embedded applications, developing technologies used across automotive, industrial and Internet of Things (IoT), mobile, and communication infrastructure segments. NXP’s offerings target customers that require reliable, secure, and high-performance semiconductor components for connected devices and systems.
Product lines include microcontrollers and application processors, secure elements and authentication technologies, RF and high-power analog components, connectivity solutions, and vehicle networking and infotainment systems.
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