BE Semiconductor Industries (OTCMKTS:BESIY) Hits New 52-Week High – Here’s What Happened

BE Semiconductor Industries NV (OTCMKTS:BESIY) hit a new 52-week high during mid-day trading on Monday . The stock traded as high as $230.44 and last traded at $230.44, with a volume of 13602 shares trading hands. The stock had previously closed at $223.92.

Analyst Upgrades and Downgrades

BESIY has been the subject of a number of research analyst reports. Citigroup reiterated a “neutral” rating on shares of BE Semiconductor Industries in a research report on Tuesday, January 20th. Morgan Stanley reaffirmed an “overweight” rating on shares of BE Semiconductor Industries in a research report on Tuesday, January 13th. Kepler Capital Markets lowered BE Semiconductor Industries from a “strong-buy” rating to a “hold” rating in a research report on Friday, January 9th. Sanford C. Bernstein reissued an “outperform” rating on shares of BE Semiconductor Industries in a research note on Sunday, January 4th. Finally, Needham & Company LLC raised shares of BE Semiconductor Industries to a “buy” rating in a research note on Tuesday, January 6th. Five investment analysts have rated the stock with a Buy rating and five have assigned a Hold rating to the company’s stock. Based on data from MarketBeat.com, the stock currently has an average rating of “Moderate Buy”.

BE Semiconductor Industries Trading Up 2.9%

The company has a market cap of $16.71 billion, a price-to-earnings ratio of 123.23 and a beta of 1.85. The company’s fifty day moving average price is $187.69 and its two-hundred day moving average price is $164.13. The company has a quick ratio of 5.02, a current ratio of 5.75 and a debt-to-equity ratio of 1.46.

BE Semiconductor Industries Company Profile

BE Semiconductor Industries NV (OTCMKTS:BESIY), commonly known as BESI, is a global supplier of assembly equipment for the semiconductor industry. The company designs, develops and manufactures capital equipment used in the back-end production of semiconductor devices, including die attach, wire bonding and flip chip packaging systems. BESI’s platforms support a wide range of applications from memory and logic chips to advanced power devices and radio-frequency modules, enabling high precision, throughput and yield in device assembly and test processes.

Founded in 1995 and headquartered in Duiven, the Netherlands, BESI went public on Euronext Amsterdam in 1999.