QUALCOMM Incorporated Plans Quarterly Dividend of $0.89 (NASDAQ:QCOM)

QUALCOMM Incorporated (NASDAQ:QCOM) declared a quarterly dividend on Friday, January 16th. Investors of record on Thursday, March 5th will be paid a dividend of 0.89 per share by the wireless technology company on Thursday, March 26th. This represents a c) annualized dividend and a yield of 2.2%. The ex-dividend date is Thursday, March 5th.

QUALCOMM has increased its dividend payment by an average of 0.1%annually over the last three years and has increased its dividend every year for the last 23 years. QUALCOMM has a payout ratio of 29.7% indicating that its dividend is sufficiently covered by earnings. Equities research analysts expect QUALCOMM to earn $9.86 per share next year, which means the company should continue to be able to cover its $3.56 annual dividend with an expected future payout ratio of 36.1%.

QUALCOMM Trading Down 1.2%

QUALCOMM stock opened at $159.42 on Friday. QUALCOMM has a 1 year low of $120.80 and a 1 year high of $205.95. The firm’s 50-day moving average is $172.10 and its 200-day moving average is $165.60. The company has a debt-to-equity ratio of 0.70, a quick ratio of 2.10 and a current ratio of 2.82. The company has a market cap of $170.74 billion, a P/E ratio of 32.60, a PEG ratio of 3.60 and a beta of 1.21.

QUALCOMM (NASDAQ:QCOM) last issued its quarterly earnings data on Wednesday, November 5th. The wireless technology company reported $3.00 EPS for the quarter, topping analysts’ consensus estimates of $2.87 by $0.13. The firm had revenue of $11.27 billion during the quarter, compared to the consensus estimate of $10.74 billion. QUALCOMM had a return on equity of 43.22% and a net margin of 12.51%.The firm’s revenue was up 10.0% on a year-over-year basis. During the same period in the prior year, the business earned $2.69 EPS. QUALCOMM has set its Q1 2026 guidance at 3.300-3.500 EPS. On average, equities analysts expect that QUALCOMM will post 9.39 earnings per share for the current year.

Key Headlines Impacting QUALCOMM

Here are the key news stories impacting QUALCOMM this week:

• Positive Sentiment: Declared quarterly cash dividend of $0.89/share (annualized yield ~2.2%); payable March 26 to holders of record March 5 — supports income investors and signals confidence in cash flow. Qualcomm Announces Quarterly Cash Dividend
• Positive Sentiment: Coverage and feature pieces highlight Qualcomm’s push into personal AI, wearables (large Ray‑Ban demand with Meta) and new Dragonwing IQ10 chips for robotics — these represent meaningful growth levers beyond handset modems. Qualcomm: Ignored Personal AI Boom
• Neutral Sentiment: RBC (RBC Capital) initiated coverage with a “sector perform” / KeyCorp issued updated Q1 EPS assumptions — analyst activity keeps the name in focus but does not currently signal a consensus upgrade. RBC Capital initiates coverage
• Negative Sentiment: Mizuho’s downgrade (covered in MarketBeat) from Outperform to Neutral and a cut to the price target flagged near‑term headwinds: expected modem share losses on upcoming Apple devices, softer global handset demand (especially China), and rising local competition — this note is the primary driver of recent selling pressure. Qualcomm: Wall Street’s Patience Is Wearing Thin
• Negative Sentiment: Trade/tariff risk: coverage highlights the potential impact of a proposed 25% tariff on AI chips — could raise costs or disrupt supply chains for semiconductor players exposed to the U.S./China/Taiwan dynamics. 5 AI Chip Stocks Most Exposed to Trump’s New 25% Tariff

QUALCOMM Company Profile

QUALCOMM Incorporated is a global semiconductor and telecommunications equipment company headquartered in San Diego, California. Founded in 1985, the company is known for its development of wireless technologies and for playing a central role in the evolution of digital cellular standards, including CDMA and subsequent generations of mobile standards. Qualcomm’s business combines the design and sale of semiconductor products with a patent licensing program for wireless technologies and related intellectual property.

The company’s product portfolio includes system-on-chip (SoC) platforms marketed under the Snapdragon brand, cellular modem and RF front-end components, connectivity solutions for Wi‑Fi and Bluetooth, and processors and platforms aimed at automotive, IoT, networking and edge-computing applications.