Oxford Instruments plc (LON:OXIG) Declares GBX 5.10 Dividend

Oxford Instruments plc (LON:OXIG) declared a dividend on Tuesday, November 12th,Upcoming Dividends.Co.Uk reports. Stockholders of record on Thursday, November 28th will be paid a dividend of GBX 5.10 ($0.06) per share on Friday, January 10th. This represents a dividend yield of 0.24%. The ex-dividend date of this dividend is Thursday, November 28th. The official announcement can be accessed at this link.

Oxford Instruments Stock Down 1.4 %

Shares of LON OXIG opened at GBX 2,079.50 ($26.12) on Tuesday. The company has a current ratio of 1.64, a quick ratio of 1.11 and a debt-to-equity ratio of 12.96. Oxford Instruments has a 12-month low of GBX 1,870 ($23.49) and a 12-month high of GBX 2,765 ($34.73). The firm’s 50-day moving average price is GBX 2,080.53 and its 200-day moving average price is GBX 2,296.01. The stock has a market capitalization of £1.21 billion, a price-to-earnings ratio of 2,404.98, a P/E/G ratio of -3.56 and a beta of 0.96.

Wall Street Analysts Forecast Growth

Several research firms have commented on OXIG. Berenberg Bank reduced their price objective on Oxford Instruments from GBX 2,925 ($36.74) to GBX 2,830 ($35.54) and set a “buy” rating on the stock in a report on Tuesday, November 12th. Shore Capital reaffirmed a “buy” rating on shares of Oxford Instruments in a report on Wednesday, October 16th.

Oxford Instruments Company Profile

Oxford Instruments plc provide scientific technology products and services for academic and commercial organizations worldwide. It operates through three segments: Materials & Characterisation, Research & Discovery, and Service & Healthcare. The company offers atomic force, electron, and Raman microscopy; deposition tools comprising plasma enhanced chemical vapour deposition, chemical vapour deposition, inductively coupled plasma chemical vapour deposition, atomic layer deposition, and ion beam deposition systems; and etch tools, including inductively coupled plasma etching, reactive ion etching, deep silicon etching, atomic layer etching, and ion beam etching systems.