Headlines about Advanced Semiconductor Engnrng (NYSE:ASX) have trended somewhat positive this week, according to Accern. The research firm scores the sentiment of press coverage by reviewing more than 20 million blog and news sources in real time. Accern ranks coverage of public companies on a scale of negative one to positive one, with scores closest to one being the most favorable. Advanced Semiconductor Engnrng earned a daily sentiment score of 0.06 on Accern’s scale. Accern also assigned media coverage about the semiconductor company an impact score of 45.9091385141869 out of 100, meaning that recent press coverage is somewhat unlikely to have an impact on the stock’s share price in the next several days.
Advanced Semiconductor Engnrng stock traded down $0.14 during trading hours on Thursday, hitting $7.24. The company had a trading volume of 536,181 shares, compared to its average volume of 905,712. The company has a debt-to-equity ratio of 0.22, a quick ratio of 1.05 and a current ratio of 1.37. Advanced Semiconductor Engnrng has a fifty-two week low of $5.86 and a fifty-two week high of $7.52. The firm has a market capitalization of $11,930.45, a PE ratio of 16.39, a price-to-earnings-growth ratio of 1.95 and a beta of 0.77.
Advanced Semiconductor Engnrng (NYSE:ASX) last announced its quarterly earnings data on Thursday, February 1st. The semiconductor company reported $0.12 earnings per share (EPS) for the quarter. Advanced Semiconductor Engnrng had a return on equity of 12.14% and a net margin of 7.95%. The firm had revenue of $2.73 billion for the quarter. equities research analysts expect that Advanced Semiconductor Engnrng will post 0.47 EPS for the current fiscal year.
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Advanced Semiconductor Engnrng Company Profile
Advanced Semiconductor Engineering, Inc is a provider of semiconductor packaging and testing services. The Company offers a range of semiconductors packaging, testing and electronic manufacturing services (EMS). The Company’s segments include Packaging, Testing, EMS and Others. The Company provides services in packaging bare semiconductors into finished semiconductors with a range of electrical and thermal characteristics, as well as testing services, including front-end engineering testing, wafer probing and final testing services.
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